Tropel MSP150 can measure the flatness, thickness and thickness tolerance of various crystal materials (sapphire, silicon carbide, gallium arsenide, glass, etc.) with a diameter of 150mm, which is essential for 3DIC integration. Traditional contact measuring instruments or common interferometers have the disadvantages of too slow measurement speed or insufficient measurement accuracy when dealing with large-sized wafers. Tropel MSP150 uses an advanced stepping laser source to quickly and accurately measure 150mm diameter wafers. Measure the entire plane and collect more than 3 million points of data in a short period of time to construct a true three-dimensional solid figure. High accuracy, fast, high repeatability, and comprehensive measurement are the advantages that Tropel MSP150 does not have in other measurement equipment in the industry.