Tropel FlatMaster MSP150 flatness measurement system

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Tropel MSP150 can measure the flatness, thickness and thickness tolerance of various crystal materials (sapphire, silicon carbide, gallium arsenide, glass, etc.) with a diameter of 150mm, which is essential for 3DIC integration. Traditional contact measuring instruments or common interferometers have the disadvantages of too slow measurement speed or insufficient measurement accuracy when dealing with large-sized wafers.
Tropel MSP150 uses an advanced stepping laser source to quickly and accurately measure 150mm diameter wafers. Measure the entire plane and collect more than 3 million points of data in a short period of time to construct a true three-dimensional solid figure. High accuracy, fast, high repeatability, and comprehensive measurement are the advantages that Tropel MSP150 does not have in other measurement equipment in the industry.

Tropel FlatMaster MSP150测量规格

性能
测量方法	步进式激光干涉法
Z轴分辨率	1nm
横向分辨率	0.15mm
测量范围	Φ150mm
测量时间	<40s
测量点数	310万点/单次测量
数据分析	3D轮廓，剖面图，圆半径等
适用材料	金属，玻璃，化合物半导体材料，硅片，陶瓷等
适用平面	线切割，研磨，抛光，蚀刻和超精表面
精度和重复性
参数	精度	重复性
翘曲度	0.06um	0.02um
厚度	0.25um	0.1um
总厚度偏差	0.1um	0.02um
Tropel 测量App（TMS）

使用环境和设备参数
温度	15°C 到 25°C
温度变化	每小时变化量≤1°C
放置装置	内置
湿度	5%到95%相对湿度
功率	100-240 VAC, 50/60 Hz, 4 Amp
真空系统	不需要
设备尺寸	160 cm x 103 cm x 150 cm
设备重量	390Kg